Electroless plating process and process for producing multilayer

Details Electroless plating process and process for producing multilayer Electroless plating process and process for producing multilayer

1985-10-10

1987-04-21

Smith, John D.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 36, 427 451, 427 531, 427 98, 427 92, 427 97, C23C 1816

Patent

active

046595872

ABSTRACT:
In a selective electroless plating process suitable for formation and correction of a minute pattern by plating film, irradiation of the surface of a workpiece with a laser beam serves to selectively activate the surface of the workpiece to allow an electroless plating film to deposited on only the activated portions. The portion of the workpiece where plating is effected is irradiated with a radiation energy beam to form a damaged portion, which is contact with a plating bath during and/or after the irradiation to selectively from a plating film on the damaged portion. The portion of a workpiece where a pole as the connector part of a multilayer wiring board is to be formed is irradiated with a laser beam and allowed to have a pole selectively formed only thereon.

REFERENCES:
patent: 4239789 (1980-12-01), Blum
patent: 4511595 (1985-04-01), Inoue
patent: 4517254 (1985-05-01), Grapentin
patent: 4526807 (1985-07-01), Auerbach

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