Electroless plating process

Details Electroless plating process Electroless plating process

1990-05-02

1993-04-27

Beck, Shrive

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 98, C23C 2600

Patent

active

052060527

ABSTRACT:
An aqueous solution comprising sulfuric acid, cupric chloride and, if necessary, an organic acid is effective as an activation accelerating treatment for electroless palting for improving electroless plating in through-holes and for improving adhesive strength between a copper foil and an electrolessly plated copper.

REFERENCES:
patent: 4181750 (1980-01-01), Beckenbaugh
patent: 4182784 (1980-01-01), Krulik
patent: 4293592 (1981-10-01), Morishita
patent: 4448804 (1984-05-01), Amelio
patent: 4540464 (1985-09-01), Mueller
patent: 4666739 (1987-05-01), Roubal
patent: 4720324 (1988-01-01), Hayward
patent: 4863758 (1989-09-01), Rhodenizer

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