Electroless plating process

Details Electroless plating process Electroless plating process

1991-09-13

1993-01-12

Beck, Shrive

Coating processes

Immersion or partial immersion

Chemical compound reducing agent utilized

427436, 427437, 106 123, C23C 2600

Patent

active

051789183

ABSTRACT:
Deposition of gold without the use of electric current is described. The system produces thick gold films without the use of strong reducing agents. Discontinuous land areas on high reliability printed wiring boards or ceramic circuits can be readily coated with gold to any desired thickness. Long lead glass-to-metal seals can be uniformly plated without distortion of the leads.

REFERENCES:
patent: 3396042 (1968-08-01), Duva
patent: 3700469 (1972-10-01), Okinaka
patent: 3798056 (1974-03-01), Okinaka
patent: 3862850 (1975-01-01), Trueblood
patent: 4091128 (1978-05-01), Franz
patent: 4162337 (1979-07-01), D Asaro
patent: 4337091 (1982-06-01), El-Shazly
patent: 4352690 (1982-10-01), Dettke
patent: 4374876 (1983-02-01), El-Shazly
patent: 4474838 (1984-10-01), Halecky
patent: 4481035 (1984-11-01), Andrarcek
J. C. Bailar et al. "Comprehensive Inorganic Chemistry" Pergamon Press, 1973, pp. 148-150.

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