Electroless plating process

Details Electroless plating process Electroless plating process

1986-05-05

1986-12-23

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

204 20, 204 26, 427 98, C25D 502, C25D 554

Patent

active

046311173

ABSTRACT:
A process for electroless plating a conductive metal layer to the surface of a non-conductive material which comprises:

REFERENCES:
patent: 409096 (1889-08-01), Blank
patent: 1037469 (1912-09-01), Goldberg
patent: 1352331 (1920-09-01), Unno
patent: 2243429 (1941-05-01), Laux
patent: 2947064 (1960-08-01), Langton
patent: 3003975 (1961-10-01), Louis
patent: 3014818 (1961-12-01), Campbell
patent: 3099608 (1963-07-01), Rodovsky et al.
patent: 3163588 (1964-12-01), Shortt et al.
patent: 3249559 (1966-05-01), Gallas
patent: 3696054 (1972-10-01), Saunders
patent: 3799802 (1974-03-01), Schneble, Jr. et al.
patent: 3910852 (1975-10-01), Lederman et al.
patent: 3941584 (1976-03-01), Tundermann et al.
patent: 4035265 (1977-07-01), Saunders
patent: 4090984 (1978-05-01), Lin et al.
patent: 4239794 (1980-12-01), Allard
patent: 4305847 (1981-12-01), Stoetzer et al.
patent: 4389268 (1983-06-01), Oshima et al.
patent: 4478882 (1984-10-01), Roberto
Pending U.S. Patent Application Ser. No. 802,892, which was filed by Karl L. Minten and Galina Pismennaya on Nov. 29, 1985.

Affiliated with

Also associated with

Rating

Electroless plating process does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electroless plating process, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electroless plating process will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-170595