Electroless plating pre-treatment solution and electroles...

Compositions: coating or plastic – Coating or plastic compositions – Metal-depositing composition or substrate-sensitizing...

Reexamination Certificate

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Details

C106S001110, C427S099500, C427S304000

Reexamination Certificate

active

10882340

ABSTRACT:
It is an object of the present invention to provide an electroless plating pre-treatment solution and an electroless plating method capable of shortening the incubation time and achieving cost reduction.As the pre-treatment solution7to be supplied onto the wafer W before the electroless plating, an aqueous solution is supplied in which an activation accelerator to accelrate the oxidative decomposition reaction of a reducing agent and an oxide layer remover to remove an oxide layer formed on the wiring portions4aare dissolved. The activation accelerator includes at least one selected from the group consisting of sulfonic acid having two or more characteristic groups, derivatives of the sulfonic, and salts of the sulfonic acid.

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patent: 2002-249891 (2002-09-01), None
patent: 2003-62468 (2003-03-01), None

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