Electroless plating of through-holes using pressure differential

Details Electroless plating of through-holes using pressure differential Electroless plating of through-holes using pressure differential

1986-08-18

1988-03-29

Morganstern, Norman

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 98, 427304, 427305, 427306, 4274431, B05D 512, B05D 304, B05D 310, B05D 118

Patent

active

047342960

ABSTRACT:
An apparatus and method for the electroless plating of articles. A tank is provided for sequentially containing the respective constituent baths corresponding to the steps of the electroless plating process. An article to be plated, such as a printed circuit board, is supported in the center of the tank immersed in the constituent bath container therein. A pair of inwardly facing parallel manifolds are disposed at opposite ends of the tank. The constituent solution is pumped through a nozzle matrix in the inward facing wall of a first manifold onto the article and is simultaneously sucked away from the opposing side of the article through the matrix of the nozzles defined in the inward facing wall of a second manifold. The direction of pumping is alternated for periodically reversing the direction of suction and impingement. The alternating pressure difference created across the surface of the article being plated substantially improves the rate of metal deposition over prior art systems and allows for a uniform and high quality plate over the entire surface of the article. Additionally, through-holes defined in the articles are thoroughly and uniformly deposited with electroless metal.

REFERENCES:
patent: 2260893 (1941-10-01), Ewing
patent: 3158500 (1964-11-01), Sallo
patent: 3413020 (1970-05-01), West
patent: 3895137 (1975-07-01), Auramidis
patent: 4143618 (1979-03-01), Del Vecchio
patent: 4174261 (1979-11-01), Pellegrino
patent: 4478882 (1984-10-01), Roberto
patent: 4622917 (1986-11-01), Schramm

Affiliated with

Also associated with

Rating

Electroless plating of through-holes using pressure differential does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electroless plating of through-holes using pressure differential, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electroless plating of through-holes using pressure differential will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1088470