Electroless plating of substrates

Details Electroless plating of substrates Electroless plating of substrates

1993-12-15

1995-05-23

Lusignan, Michael

Stock material or miscellaneous articles

Composite

Of epoxy ether

427306, 427437, 4274431, 428458, 428460, B32B 1508, B32B 2738

Patent

active

054180643

ABSTRACT:
Electroless deposition of copper from solution onto a substrate, particularly a polymeric laminate for use in electronic circuitry, is accomplished by first treating said substrate with a stilbene-based fluorescent brightener to sensitize said substrate and thereafter contacting said substrate first with a solution of a catalytic metal and then with an electroless copper plating solution.

REFERENCES:
patent: 3011920 (1961-12-01), Shipley
patent: 3682671 (1972-08-01), Zeblisky
patent: 5043253 (1991-08-01), Ishikawa
patent: 5292557 (1994-03-01), Olson

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