Electroless plating of substrates

Details Electroless plating of substrates Electroless plating of substrates

1992-11-16

1994-03-08

Beck, Shrive

Coating processes

Immersion or partial immersion

Metal base

427306, 4274431, B05D 100

Patent

active

052925579

ABSTRACT:
Electroless deposition of copper from solution onto a substrate, particularly a polymeric laminate for use in electronic circuitry, is accomplished by first treating said substrate with a stilbene-based fluorescent brightener to sensitize said substrate and thereafter contacting said substrate with an electroless copper plating solution.

REFERENCES:
patent: 3011920 (1961-12-01), Shipley, Jr.
patent: 3682671 (1972-08-01), Zeblisky
patent: 3956283 (1976-05-01), Fleck
patent: 4111960 (1978-09-01), Sam
patent: 4997724 (1991-03-01), Suzuki
patent: 5112440 (1992-05-01), Banks
Chemical Abstract 73(20):100068d, vol. 73, 1970, p. 66.
Chemical Abstract 114(6):45544u, vol. 114, 1991, p. 144.

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