Electroless plating of polycarbonates

Coating processes – With pretreatment of the base – Etching – swelling – or dissolving out part of the base

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156668, 427306, C23C 302, B29C 1708

Patent

active

043259928

ABSTRACT:
Filled polycarbonate resin substrates are conditioned for electroless plating by contact with an alkaline conditioner having a pH of at least 8, followed by contact with an aqueous acid fluoride etch solution having a pH less than about 5 and a fluoride concentration of at least 1 mole per liter of solution.

REFERENCES:
patent: 3252844 (1966-05-01), Hechelhammer
patent: 3394023 (1968-07-01), Wilhelm
patent: 3518067 (1970-06-01), Barth
patent: 3567594 (1971-03-01), Wells
patent: 4125649 (1978-11-01), Donovan et al.

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