Electroless plating of nonconductive substrates

Details Electroless plating of nonconductive substrates Electroless plating of nonconductive substrates

1975-05-05

1980-07-15

Niebling, John F.

Compositions

Preservative agents

Anti-oxidants or chemical change inhibitants

252429R, 252440, 252434, 252436, 106 124, 106 128, 427304, 204 30, B01J 2706, C09D 500, C23C 300

Patent

active

042127688

ABSTRACT:
An electroless plating catalyst prepared by reacting a tin salt in the molten state with a precious metal compound without HCl or added H.sub.2 O. The final catalyst may be a solid or a liquid at room temperature, depending on the reaction conditions, and it can be reconstituted by dilution with an appropriate aqueous solution to prepare or replenish catalytic working baths for electroless plating. Examples include the molten salt reaction of a noble metal salt with molten stannous chloride, stannous chloride dihydrate, or mixtures with other compatible materials containing either or both.

REFERENCES:
patent: 3011920 (1961-12-01), Shipley
patent: 3532518 (1970-10-01), D'Ottavio
patent: 3565823 (1971-02-01), Parshall
patent: 3672923 (1972-06-01), Zeblisky
patent: 3817774 (1974-06-01), Kuzmik
patent: 3874897 (1975-04-01), Fadgen
patent: 3902908 (1975-09-01), Rantell

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