Electroless plating of metallic features on nonmetallic or semic

Details Electroless plating of metallic features on nonmetallic or semic Electroless plating of metallic features on nonmetallic or semic

1997-03-11

1998-12-08

Utech, Benjamin

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

4273766, 427437, 427438, B05D 512

Patent

active

058465987

ABSTRACT:
In the manufacture of a microelectronic component having metallic features on a polyimide layer, the metallic features being spaced from one another by gaps, at least some of which gaps have widths in a range from about one micron to about 500 microns, corrosion protection is provided by plating those features by electroless deposition of a nickel-phosphorus alloy forming a layer having a thickness in a range from about 200 .ANG. to about 3000 .ANG., at a rate of about 100 .ANG. per minute, in an aqueous plating bath comprising nickel sulfate hexahydrate in an amount of about 5.5 grams per liter, sodium hypophosphite in an amount of about six grams per liter, boric acid in an amount of about 30 grams per liter, sodium citrate in an amount of about 45 grams per liter, lead acetate in an amount of about one part per million by weight of lead, and a surfactant in an amount of about 0.1 grams per liter. The bath has a temperature of about 72.degree. C. and a pH of about 8.1. The gaps having widths of at least one micron remain essentially free of extraneous plating.

REFERENCES:
patent: 2532283 (1950-12-01), Brenner
patent: 2884344 (1959-04-01), Ramirez
patent: 2994369 (1961-08-01), Carlin
patent: 3672940 (1972-06-01), Funada et al.
patent: 4072781 (1978-02-01), Shirahata et al.
patent: 4169171 (1979-09-01), Narcus
patent: 4514586 (1985-04-01), Waggoner
patent: 4600609 (1986-07-01), Leever et al.
patent: 4770899 (1988-09-01), Zeller
patent: 4997686 (1991-03-01), Feldstein et al.
patent: 5026616 (1991-06-01), Schumm, Jr.
patent: 5250105 (1993-10-01), Gomes et al.
patent: 5269838 (1993-12-01), Inoue et al.
patent: 5300330 (1994-04-01), Feldstein et al.
patent: 5382447 (1995-01-01), Kaja et al.
patent: 5403650 (1995-04-01), Baudrand et al.
F.A. Lowenheim, Ed., Modern Electroplating, Third Edition, Wiley-Interscience, New York (1974) pp. 710-731, 744, 745.
F. A. Lowenheim, Electroplating, McGraw-Hill, New York (1978) pp. 389-400.

Affiliated with

Also associated with

Rating

Electroless plating of metallic features on nonmetallic or semic does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electroless plating of metallic features on nonmetallic or semic, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electroless plating of metallic features on nonmetallic or semic will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-174946