Electroless plating method with inspection for an unbroken layer

Coating processes – Measuring – testing – or indicating

Patent

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Details

427140, 427142, 427304, 427305, 427306, 427430A, C23C 302

Patent

active

041548698

ABSTRACT:
Improvements are disclosed in the method of electroless deposition of a metal on a nonconductive surface wherein the surface is sequentially contacted with a tin salt solution, a palladium salt solution, and an electroless plating bath containing said metal. The improvement relates to preparing the surface to produce an unbroken layer of water adhering thereto upon dipping said surface in deionized water. The improvement further contemplates removing the surface from the electroless plating bath after formation of the visible amount of metal, inspecting the surface for imperfections, removing the metal, and recleaning the surface to remove imperfections. Finally, the activation steps are repeated followed by contacting the surface with an electroless plating bath to plate the desired quantity of metal thereon in a manner wherein uniformity and adhesion are improved.

REFERENCES:
patent: 3442683 (1969-05-01), Lenoble et al.
patent: 3639143 (1972-02-01), Lussow et al.
patent: 3798050 (1974-03-01), Franz
patent: 4002779 (1977-01-01), Nischwitz
patent: 4042730 (1977-08-01), Cohen et al.
patent: 4066809 (1978-01-01), Alpaugh et al.
patent: 4072772 (1978-02-01), Franz

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