Electroless plating method for treating teeth

Details Electroless plating method for treating teeth Electroless plating method for treating teeth

1974-10-10

1976-12-07

Kendall, Ralph S.

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

204 38B, 427 2, 427 4, 427304, 427305, 428 16, A61K 502, C23C 302

Patent

active

039953718

ABSTRACT:
An electroless plating method for providing a thin adherent substantially continuous metallic layer over an osseous substrate such as a tooth structure. The method comprises contacting the substrate with an aqueous plating mixture containing a water-soluble salt of a metal selected from the group consisting of gold, silver, copper, nickel, platinum, palladium and tin, and a reducing agent for the metal ions of said salt. The plating mixture is maintained in contact with the substrate for a time sufficient for the metallic layer to form thereon. The metallic layer so provided is adapted for subsequent application of a tooth restorative material such as a dental amalgam for carrying out a tooth restoration.

REFERENCES:
patent: 2454610 (1948-11-01), Narcus
patent: 2464143 (1949-03-01), Martinson
patent: 2702253 (1955-02-01), Bergstrom
patent: 2802268 (1957-08-01), Knappwost
patent: 3093509 (1963-06-01), Wein

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