Coating processes – Immersion or partial immersion – Chemical compound reducing agent utilized
Patent
1991-08-21
1993-07-27
Lusigan, Michael
Coating processes
Immersion or partial immersion
Chemical compound reducing agent utilized
427304, 427305, 427306, 427437, C23C 2600
Patent
active
052309282
DESCRIPTION:
BRIEF SUMMARY
FIELD OF TECHNOLOGY
This invention relates to a novel electroless plating method which requires no pre-treatment step for the surface-corrosion on the surface to be plated, wherein a metal layer is formed by applying, onto the surface to be plated, a solution of a composition consisting of a styrene type elastomer used generally as a component for the hot melt type adhesive agent, or the styrene type elastomer and a stickiness imparting resin of a molecular structure similar to that of the elastomer; drying the solution as applied; and effecting the electroless plating on the coated film thus obtained, the method being able to substitute the conventional electroless plating as an advance step of the electrolytic plating for synthetic resin. The particular object of the present invention is to utilize the method in the field of the electroless plating for the purpose of preventing the plating operation from the electromagnetic wave disturbances.
BACKGROUND TECHNOLOGY
The electroless plating is effected as a step for rendering a non-electrically conductive body such as synthetic resin products to become electrically conductive so that it may be subjected to the electrolytic plating, wherein the surface of the non-electrically conductive product to be plated is subjected to a pre-treatment for corroding it by any method to form very fine holes due to corrosion, and, in the electroless plating to be carried out subsequently, the plated layer is bonded to the surface of the base material by the anchoring effect of the metal to be deposited in the inner surface of the holes from the corrosion.
Further, there has been effected, for the printed circuit wiring board, a method, in which the electroless plating is carried out, after a curing type adhesive agent to be more corrosive than the base material is applied on the surface to be plated to corrode the surface.
This method accompanies, at any rate a corrosion step by use of strong chemicals, which corroding step comprises a pre-treatment step and post-treatment a step of defattening, rinsing, neutralizing, rinsing, etc. before and after this corroding step.
Further, as the conventional technique of intercepting the electromagnetic wave, there are various methods such as application of electrically conductive paint, flame coating of zinc, laminating layers of electrically conductive synthetic resin filled with an electrically conductive substance, or forming a sandwich structure with this electrically conductive synthetic resin layer as a core, and others. Of these various methods, the application of the electrically conductive paint has been widely used.
Any of these methods, however, cannot be said to have exhibited satisfactory effect. Even the most widely used electrically conductive paint is very expensive in price, and, in addition, the paint coating is required to be made thick, which would increase the cost for painting work.
In recent years, the electromagnetic wave intercepting effect of the coating formed by the electroless plating has become highly evaluated, but it has still not attained its diffusion owing to its point of problem to be mentioned hereinbelow.
Besides the conventional electroless plating technique comprises long and time-taking process steps, it is required to take anti-pollution measures, because the process utilizes a large quantity of strong corrosive liquid such as chromic acid, sulfuric acid, and so forth, as mentioned in the foregoing. Therefore, this technique has its restriction such that it cannot be put into practice where there is no facility for these measures, and also has an economical problem of bearing the cost for the anti-pollution measures.
When the plating is effected on a synthetic resin, special brands of resins adapted for the plating should be used, which resins are more expensive than ordinary resins. Therefore, no electroless plating is effected on the synthetic resins other than those which can meet the strict requirement for the interceptibility against electromagnetic wave.
In contrast to the conventio
REFERENCES:
patent: 3471320 (1969-10-01), Sanbestre
patent: 4148945 (1979-04-01), Bangs
patent: 4216246 (1980-08-01), Iwasaki
patent: 4246320 (1981-01-01), Coll-Palagos
patent: 4448811 (1984-05-01), Doty
English translation of Japanese Patent 53-59767.
Takagi Kaneyuki
Yago Masayuki
Yoshikawa Syuki
Dang Vi Duong
Lusigan Michael
Sankei Giken Kogyo Kabushiki Kaisha
LandOfFree
Electroless plating method does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Electroless plating method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electroless plating method will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2341303