Electroless plating bath monitor

Coating processes – Measuring – testing – or indicating

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427 10, 4274431, C23C 1816

Patent

active

046264469

ABSTRACT:
Method and apparatus for determining the deposition capability of an electroless metal plating bath by monitoring the difference in instantaneous electrical potential between a pair of test coupons immersed in the bath in which one coupon is seeded to initiate plating thereon of the bath metal and the other coupon has a surface of the bath metal. The magnitude of the difference in potential and its change with respect to time during concurrent immersion of both coupons indicate the probable rate and quality of the bath deposition onto work pieces.

REFERENCES:
patent: 3375178 (1968-03-01), Locke
patent: 3775277 (1973-11-01), Pompei et al.
patent: 4006063 (1977-02-01), Ensanian
patent: 4125642 (1978-11-01), Petit et al.
patent: 4182638 (1980-01-01), Cooke et al.
patent: 4331699 (1982-05-01), Suzuki et al.
patent: 4477484 (1984-10-01), Paoletti et al.
Greene, "Evaluating the Condition of Electroless Plating Baths", IBM TDB, vol. 7, No. 3, Aug. 1964.
Tucker, "Instrumentation and Control of Electroless Copper Plating Solutions", Design and Finishing of Printed Wiring and Hybrid Circuits Symposium, Ft. Worth, Texas, Jan. 21-22, 1976.
"Continuous Monitoring of Plating Bath Plating Rate", M. J. Canestaro, IBM Technical Disclosure Bulletin, vol. 17, No. 6, Nov. 1974, p. 1581.

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