Electroless plating bath composition and method of using

Details Electroless plating bath composition and method of using Electroless plating bath composition and method of using

2005-06-21

2005-06-21

Klemanski, Helene (Department: 1755)

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

C106S001230, C106S001240, C106S001250, C106S001260, C106S001280

Reexamination Certificate

active

06908504

ABSTRACT:
The present invention relates to a cobalt electroless plating bath composition and method of using it for microelectronic device fabrication. In one embodiment, the present invention relates to cobalt electroless plating in the fabrication of interconnect structures in semiconductor devices.

REFERENCES:
patent: 4600609 (1986-07-01), Leever et al.
patent: 5203911 (1993-04-01), Sricharoenchaikit et al.
patent: 5562760 (1996-10-01), Ballard et al.
patent: 5645628 (1997-07-01), Endo et al.
patent: 5695810 (1997-12-01), Dubin et al.
patent: 5718745 (1998-02-01), Itoh et al.
patent: 5755859 (1998-05-01), Brusic et al.
patent: 5897965 (1999-04-01), Itoh et al.
patent: 6183545 (2001-02-01), Okuhama et al.
patent: 6235093 (2001-05-01), Okuhama et al.
patent: 6455175 (2002-09-01), Kozlov et al.
patent: 6717189 (2004-04-01), Inoue et al.
patent: 2002/0185658 (2002-12-01), Inoue et al.
patent: 2004/0038073 (2004-02-01), Chebiam et al.
patent: 2004/0134375 (2004-07-01), Kolics et al.
patent: 2004/0175509 (2004-09-01), Kolics et al.
patent: 0073583 (1983-03-01), None
Derwent abstract of JP61/186275, Aug. 1986.

Affiliated with

Also associated with

Rating

Electroless plating bath composition and method of using does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electroless plating bath composition and method of using, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electroless plating bath composition and method of using will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3490128