Electroless plating bath

Details Electroless plating bath Electroless plating bath

1991-06-12

1992-11-03

Dixon, Jr., William R.

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

106 127, C23C 1834

Patent

active

051603730

ABSTRACT:
An electroless plating bath for depositing a metal selected from the group consisting of Ni, Zn, As, Cd, In, Sb, Pb and alloys thereof, which contains a titanium (III) compound as a reducing agent. Typical titanium (III) compounds are titanium halides, cyclopentadienyl complex compounds of titanium (III) ions, titanium sulfate, and titanium hydroxide.

Affiliated with

Also associated with

Rating

Electroless plating bath does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electroless plating bath, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electroless plating bath will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2047910