Electroless plating apparatus and electroless plating method

Details Electroless plating apparatus and electroless plating method Electroless plating apparatus and electroless plating method

2011-02-01

2011-02-01

Edwards, Laura (Department: 1713)

Coating apparatus

Immersion or work-confined pool type

With tank structure, liquid supply, control, and/or...

C118S603000, C118S610000

Reexamination Certificate

active

07878144

ABSTRACT:
An electroless plating apparatus can form a protective film on exposed surfaces of embedded interconnects stably with good selectivity for thereby protecting the interconnects. The electroless plating apparatus includes a magnetic removal portion for magnetically removing small magnetic suspended solids in an electroless plating solution which have not been removed by a filter.

REFERENCES:
patent: 5795471 (1998-08-01), Naito
patent: 6800121 (2004-10-01), Shahin
patent: 10-140363 (1998-05-01), None

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