Electroless plating

Details Electroless plating Electroless plating

1980-12-18

1982-03-23

Kendall, Ralph S.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 98, 427305, 427306, 427307, C23C 302

Patent

active

043212859

ABSTRACT:
Metallic surfaces are imparted to non-conductive or dielectric substrates by an electroless coating process comprising coating the surface of the substrate with a hydrous oxide colloid of non-precious metal ions preferably selected from the group consisting of cobalt, nickel and copper ions, reducing the selected metal ions to a reduced or zero valence state with a suitable reducing agent, and exposing the substrate to an electroless plating bath.

REFERENCES:
patent: 3011920 (1961-12-01), Shipley
patent: 3500927 (1970-02-01), Simpson
patent: 3657003 (1972-04-01), Kenney
patent: 3672923 (1972-06-01), Zebisky
patent: 3925578 (1975-12-01), Polichette
patent: 3958048 (1976-05-01), Donovan
patent: 3993799 (1976-11-01), Feldstein
Weiser, "Inorganic Colloid Chemistry", vol. 1, p. 137.

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