Electroless plating

Coating processes – Electrical product produced – Welding electrode

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Details

106 111, 427 98, 427304, 427305, 427306, 427261, C23C 302

Patent

active

041501713

ABSTRACT:
Dielectric or non-conductive substrates are electrolessly plated by contacting the surface of the substrate with aqueous solutions containing stannous and copper ions, the solutions being alternatively combined with a single solution, followed by contacting the surface of the substrate with a reducing agent capable of reducing the valence state of the copper ions. Systems of solutions useful in the practice of the aforesaid process are also disclosed.

REFERENCES:
patent: 3524754 (1970-08-01), Blytas et al.
patent: 3562005 (1971-02-01), De Angelo et al.
patent: 3672925 (1972-06-01), Feldstein
patent: 3772078 (1973-11-01), Polichette et al.
patent: 3793072 (1974-02-01), Lando
patent: 3962494 (1976-06-01), Nuzzi
patent: 3993491 (1976-11-01), Feldstein
patent: 4084023 (1978-04-01), Dafter

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