Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
Patent
1986-02-04
1987-05-19
Ramsey, Kenneth J.
Metal fusion bonding
Process
Metal to nonmetal with separate metallic filler
350332, 445 24, H05B 4300, H01J 153
Patent
active
046660780
ABSTRACT:
A display panel includes a transparent substrate, a transparent conductive, patterned metallic oxide layer including terminals disposed thereon, an electroless plated metal layer on the terminals and an electroless plated solder layer on the metal layer.
REFERENCES:
patent: 3671311 (1972-06-01), Tarnopol et al.
patent: 4029393 (1977-06-01), Dungan et al.
patent: 4422731 (1983-12-01), Droguet et al.
Schmeekenbeeher IBM Technical Disclosure Bulletin vol. 18, No. 7, p. 2167 (12-1975).
Shang IBM Technical Disclosure Bulletin vol. 22, No. 5, p. 1801 (10-1979).
Tanner et al., "An All-Plated, Low Cost Contact System for Silicon Solar Cells" IEEE Photovoltaic Specialists Conference Papers, pp. 800-804 Jan. 1980.
Kaplan Blum
Ramsey Kenneth J.
Seiko Epson Kabushiki Kaisha
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