Electroless Pb-Sn alloy plating bath composition

Details Electroless Pb-Sn alloy plating bath composition Electroless Pb-Sn alloy plating bath composition

1991-04-30

1992-08-04

Dixon, Jr., William R.

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

106 125, C23C 1831

Patent

active

051355744

ABSTRACT:
An electroless Pb-Sn alloy plating bath composition is obtained by mixing at least one of methane sulfonic acid, 1-hydroxyethane-1, 1-diphosphoric acid and a salt of 1-hydroxyethane-1, 1-diposphoric acid, compounds for forming Pb-Sn alloy and a reducing agent.

REFERENCES:
patent: 4194913 (1980-03-01), Davis
patent: 4459185 (1984-07-01), Obata et al.
patent: 4565610 (1986-01-01), Nobel et al.
patent: 4582576 (1986-04-01), Opaskar et al.
patent: 4662999 (1987-05-01), Opaskar et al.
patent: 4828657 (1989-05-01), Fukuoka et al.
patent: 4871429 (1989-10-01), Nobel et al.
Patent Abstracts of Japan, vol. 13, No. 472 (C-647) (3820) 25 Oct. 1989, & JP-A-1 184 279 (Shinko Electric Ind. Co. Ltd.) 21 Jul. 1989.

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