Electroless palladium process

Details Electroless palladium process Electroless palladium process

1982-09-27

1984-01-03

Smith, John D.

Coating processes

Immersion or partial immersion

Chemical compound reducing agent utilized

106 124, 106 128, 427 92, 427305, 427437, C23C 302

Patent

active

044242417

ABSTRACT:
A process is described for electrolessly plating palladium metal on a variety of surfaces including palladium surfaces. The process involves use of a special electroless plating bath which is sufficiently stable for practical commercial use and yields excellent plating results. The plating bath contains a palladium salt and organic ligand. A narrow class of reducing agents is used including formaldehyde. The bath is made acid generally by the addition of nitric acid or hydrochloric acid. The process yields plating rates of about 6 microinches per minute and plating thicknesses in excess of 1 micrometer.

REFERENCES:
patent: 3130072 (1964-04-01), Duva
patent: 3274022 (1966-09-01), Rhoda
patent: 3285754 (1966-11-01), Hopkin
patent: 3418143 (1968-12-01), Sergienko
patent: 3754939 (1973-08-01), Pearlstein
patent: 4255194 (1981-03-01), Hough
patent: 4279951 (1981-07-01), Hough
Coleman et al., "The Pd.sub.2 Si-(PD)-Ni Solder Plated Metallization . . . " Conference: 13th IEEE Photovoltaic Specialists Conference-1978, Washington, DC USA (Jun. 5-8 1978).

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