Electroless palladium plating composition

Details Electroless palladium plating composition Electroless palladium plating composition

1992-07-30

1994-03-08

Klemanski, Helene

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

106 105, C23C 1844

Patent

active

052923614

ABSTRACT:
An electroless palladium plating composition which comprises (1) 0.001-0.1 mol/l of a palladium compound, (2) 0.01-1 mol/l of a hypophosphite compound, (3) 0.01-5 mol/l of at least one member selected from the group consisting of ammonia and alkylamine compounds, (4) 0.01-20 mg/l of high-molecular weight polyethyleneimine having molecular weight of 300 to 100000 and (5) 0.01-10 g/l of an aliphatic alkyenylamine, and which is used at a pH in the range of 5-10.

REFERENCES:
patent: 4248632 (1981-02-01), Ehrich et al.
patent: 5158604 (1992-10-01), Morgan et al.

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