Electroless nickel plating solution and method

Details Electroless nickel plating solution and method Electroless nickel plating solution and method

1997-09-17

1999-06-08

Utech, Benjamin

Coating processes

Immersion or partial immersion

Metal base

427437, 4274431, 106 122, 106 123, H01L 21302

Patent

active

059103400

ABSTRACT:
To an electroless nickel plating solution comprising a water-soluble nickel salt, a reducing agent, and a complexing agent is added a polythionate or dithionite. The invention also provides a high-build electroless gold plating method comprising the steps of immersing a workpiece in the electroless nickel plating bath, thereby chemically depositing a nickel coating on the workpiece, and immersing the nickel-plated workpiece in an electroless gold plating bath, thereby chemically depositing a gold coating on the workpiece.

REFERENCES:
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patent: 4169171 (1979-09-01), Narcus
patent: 4503131 (1985-03-01), Baudrand
patent: 4913787 (1990-04-01), Kiso
patent: 4963974 (1990-10-01), Ushio et al.
patent: 5232744 (1993-08-01), Nakamura et al.
patent: 5266103 (1993-11-01), Uchida et al.
patent: 5318621 (1994-06-01), Krulik et al.

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