Electroless nickel plating composition and method

Coating processes – Immersion or partial immersion – Metal base

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427 98, C23C 1834

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active

046954899

ABSTRACT:
A method of applying nickel directly to a non-activated tungsten surface is disclosed, in which the tungsten surface is immersed in an aqueous electroless nickel plating bath containing a water-soluble nickel salt; ethylenediaminetetraacetic acid; hydrazine; and monoethanolamine for a period of time sufficient to deposit a layer of nickel on the tungsten surface.

REFERENCES:
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patent: 3935345 (1976-01-01), Lema
patent: 4407860 (1983-10-01), Fleming
patent: 4590095 (1986-05-01), Park
Simpson, "Hydrazine: A Powerful Metal Reductant" Metal Finishing; Apr. 1985, pp. 57-60.
Kaiser et al., "A Fabrication Technique . . . ", Solid State Technology/May 1972, pp. 35-40.
Haddad et al., "Activation of Catalyst for Electroless Plating on Molybdenum", IBM TDB vol. 19, No. 3, Aug. 1976, p. 929.
Baudrand, "Electroless Nickel Plating on Metallized Ceramic" Plating and Surface Finishing, Sep. 1981, pp. 67-70.
V. M. Gershov et al., Temperature Activation of Chemical Nickel-Plating in Hydrazine Solutions, Russian Engineering Journal, vol. 53, No. 10, pp. 73-74.
V. M. Gershov et al., Intensification of the Chemical Nickel-Plating Process in Hydrazine Containing Solutions, Russian Engineering Journal, vol. 58, No. 5, pp. 37-38.
D. J. Levy, Thin Nickel Films by Hydrazine Autocatalytic Reduction, Electrochemical Technology, Jan.-Feb. 1963, pp. 38-42.
J. Dini et al., Thick Nickel Deposits of High Purity by Electroless Methods, Plating, Apr. 1967, pp. 385-390.

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