Electroless nickel plating

Details Electroless nickel plating Electroless nickel plating

1976-10-21

1979-05-01

Hayes, Lorenzo B.

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

427438, C23C 302

Patent

active

041521641

ABSTRACT:
This invention relates to electroless metal deposition and more specifically, to a process where a plating solution is brought to equilibrium and thereafter operated with the concentration of plating reactants and by-products maintained substantially constant. The plating solution treated in accordance with the invention is one having evaporative losses of at least one percent per plating cycle. Following the process, a plating solution can be operated indefinitely and yields a metal plate of uniform quality and predictable properties at any time during use of the solution. The invention avoids the known problems of by-product build-up and variable concentration of reactants typically associated with the use of such solutions.

REFERENCES:
patent: 2872354 (1959-02-01), Lee
patent: 3805023 (1974-04-01), Wainer et al.
patent: 3832168 (1974-08-01), Gulla
patent: 3876434 (1975-04-01), Dutkewych et al.

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