Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Reexamination Certificate
2005-08-30
2005-08-30
Klemanski, Helene (Department: 1755)
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
C427S437000, C427S438000, C106S001220, C106S001270
Reexamination Certificate
active
06936302
ABSTRACT:
There is provided an electroless Ni—B plating liquid for forming, a Ni—B alloy film on at least part of the interconnects of an electronic device having an embedded interconnect structure, the electroless Ni—B plating liquid comprising nickel ions, a complexing agent for nickel ions, a reducing agent for nickel ions, and ammonums (NH4+). The electroless Ni—B plating liquid can lower the boron content of the resulting plated film without increasing the plating rate and form a Ni—B alloy film having an FCC crystalline structure.
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Ezawa Hirokazu
Inoue Hiroaki
Matsumoto Moriji
Miyata Masahiro
Nakamura Kenji
Ebara Corporation
Klemanski Helene
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