Coating processes – With pretreatment of the base – Etching – swelling – or dissolving out part of the base
Patent
1992-04-27
1994-05-10
Bell, Janyce
Coating processes
With pretreatment of the base
Etching, swelling, or dissolving out part of the base
427304, 427305, 427306, 427282, 427404, 4274071, 4274191, 427 96, 427 98, 430 8, B05D 206
Patent
active
053105800
ABSTRACT:
Improved adhesion of electroless metal deposited on an organic dielectric layer with phase separated morphology is accomplished by the spontaneous formation of a morphologically and topographically rough surface. In one embodiment a ternary solution of a polar solvent and two polymer precursors of the same polymer which are separable in two phases of different order are cast in film on a substrate and heated to form two phases of different order to spontaneously produce a rough surface. Upon exposure to an alkaline solution, one phase is etched at a faster rate than the other. Seeding and electroless deposition of a metal on the rough surface results in improved adhesion of the metal to the dielectric layer. In a second embodiment a quaternary solution of a polar solvent, a seeding agent, two polymer precursors of the same polymer which are separable in two phases of different order are cast in a thin film on a substrate and heated to form three phases. Upon curing the precursors there is surface roughening as a result of phase separation. Upon exposure to alkaline solution there is etching of one of the polymer phases at a faster rate and simultaneous opening of the seeding colloid. The rough surface is overcoated with a photoresist, exposed and developed. Subsequent electroless metal deposition results in improved metal to dielectric layer adhesion. The method is applicable to selective deposition of electroless copper onto a polyimide layer.
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O'Sullivan Eugene J.
O'Toole Terrence R.
Roldan Judith M.
Romankiw Lubomyr T.
Sambucetti Carlos J.
Bell Janyce
Feig Philip J.
International Business Machines - Corporation
Kaufman Stephen C.
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