Electroless gold plating solutions

Compositions: coating or plastic – Coating or plastic compositions – Metal-depositing composition or substrate-sensitizing...

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106 126, C23C 1842

Patent

active

052580628

ABSTRACT:
An electroless gold plating solution comprises a base solution containing an alkaline hydroxide, water-soluble gold salt, boron hydrides, amino branes, and alkali metal cyanate, and further contains at least one of chemicals that of a fatty unsaturated alcohol, fatty unsaturated polyhydric alcohol, fatty unsaturated carboxylic acid, and derivatives thereof.

REFERENCES:
patent: 3123484 (1964-03-01), Pokras et al.
patent: 4374876 (1983-02-01), El-Shazly et al.
patent: 4804559 (1989-02-01), Ushio et al.
patent: 4880464 (1989-11-01), Ushio et al.
patent: 4919720 (1990-04-01), Stavitsky
patent: 5130168 (1992-07-01), Mathe et al.

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