Electroless gold plating solution and method for plating gold th

Details Electroless gold plating solution and method for plating gold th Electroless gold plating solution and method for plating gold th

1990-09-11

1993-03-30

Lusignan, Michael

Coating processes

Immersion or partial immersion

Metal base

427304, 427305, 427306, 4274431, C23C 2600

Patent

active

051982730

ABSTRACT:
The present invention provides an electroless gold plating solution comprising essentially gold ions, a complexing agent, and a reducing agent, characterized by further containing a reduction promoter which has a function of giving electrons to an oxidant, the oxidant being produced from oxidation of the reducing agent with the gold ions being reduced, to change the oxidant to the original reducing agent. The present invention also provides a process for conducting electroless gold plating by bringing a substrate into contact with the electroless gold plating solution. The plating solution is excellent in the stability for gold plating of high deposition rate. Thus the present invention allows the electroless gold plating to be performed stably at a higher deposition rate.

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"Science for Electroplaters", Metal Finishing, Aug. 1966, pp. 73, 74, 76.
European Search Report, dated 14 Jun. 1991.
Patent Abstracts of Japan, vol. 13, No. 466 (C-646) [3814], 20th Oct. 1989; & JP-A-1 180 985 (Hitachi).

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