Electroless gold plating solution

Details Electroless gold plating solution Electroless gold plating solution

1996-08-02

1997-08-26

Klemanski, Helene

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

106 126, C23C 1852

Patent

active

056606192

ABSTRACT:
The present invention provides an electroless gold plating solution which does not precipitate gold at high concentrations of thallium or lead compound, while retaining its effects such as increased deposition rate and larger crystallite sizes in the deposited layer. The electroless gold plating solution according to the invention contains 0.1-10 g/l of a chelating agent, such as diethylenetriaminepentaacetic acid (DTPA), ethylenediaminetetraacetic acid or nitrilotriacetic acid, DTPA being a preferable agent.

REFERENCES:
patent: 3700469 (1972-10-01), Okinaka
patent: 4307136 (1981-12-01), Prost-Tournier et al.
patent: 4337091 (1982-06-01), El-Shazly et al.
patent: 4792469 (1988-12-01), Saito et al.
patent: 5035744 (1991-07-01), Nishiyama et al.
patent: 5130168 (1992-07-01), Mathe et al.
patent: 5277790 (1994-01-01), Morrissey
patent: 5292361 (1994-03-01), Otsuka et al.
patent: 5338343 (1994-08-01), Kroll et al.
patent: 5380562 (1995-01-01), Hattori et al.
patent: 5560764 (1996-10-01), Wachi et al.

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