Electroless gold plating solution

Details Electroless gold plating solution Electroless gold plating solution

1986-10-24

1988-12-20

Barr, Josephine

Coating processes

Immersion or partial immersion

Chemical compound reducing agent utilized

427437, 106 123, 106 126, B05D 118, B22F 700

Patent

active

047924691

ABSTRACT:
An amine, such as a triethanol amine or ethylenediamine is added to an alkaline electroless gold plating solution comprising a gold salt and a boron-based reducing agent to deposit a gold film having good appearance and high throwing power on a workpiece at a high deposition rate.

REFERENCES:
patent: 4307136 (1981-12-01), Tournier
Patent Abstracts of Japan, unexamined applications, C field vol. 9, No. 271, Oct. 29, 1985.

Affiliated with

Also associated with

Rating

Electroless gold plating solution does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Electroless gold plating solution, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electroless gold plating solution will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1909031