Electroless gold plating solution

Details Electroless gold plating solution Electroless gold plating solution

1988-01-14

1989-11-14

Silverberg, Sam

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

106 126, C09D 510

Patent

active

048804649

ABSTRACT:
An electroless gold plating solution comprising a thiosulfato gold(I) complex, a thiosulfate, thiourea, a pH regulator and a stabilizer. The electroless gold plating solution shows a plating rate and a plating solution stability comparable to those of conventional gold plating solutions containing cyanide ions, and requires a smaller amount of reducing agent to be used therein. Further, the electroless gold plating solution is safe because it does not contain cyanide ions.

REFERENCES:
patent: 3300328 (1967-01-01), Luce
patent: 3697296 (1972-10-01), Bellis

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