Electroless gold plating solution

Details Electroless gold plating solution Electroless gold plating solution

2006-04-04

2006-04-04

Klemanski, Helene (Department: 1755)

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

C106S001260, C427S443100

Reexamination Certificate

active

07022169

ABSTRACT:
An electroless gold plating solution is provided that contains no cyanide compound as a source of gold and that contains a decomposition inhibitor represented by general formula (1), provided that, in a case in which the solution contains a gold complex of sulfite and the decomposition inhibitor is cytosine, the pH 6.0 or less is excluded.In the formula, R1to R4denote hydrogen atom(s), alkyl group(s) having 1 to 10 carbon atom(s), which may have substituent(s), aryl group(s) having 6 to 10 carbon atoms, which may have substituent(s), alkoxy group(s) having 1 to 10 carbon atom(s), which may have substituent(s), amino group(s) (—NH2), hydroxyl group(s) (—OH), ═O, or halogen atom(s),R2and R3or R3and R4may crosslink with each other and form a saturated or unsaturated ring and the saturated or unsaturated ring may include oxygen, sulfur or nitrogen atom(s), each of the above-mentioned substituents may be a halogen atom or a cyano group, andmay be a single bond or a double bond.

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Honma, H., et al., “Electroless Gold Plating by Disulfiteaurate Complex, ” Plating & Surface Finishing, vol. 82, No. 4, 89-92, Apr. 1995.

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