Electroless gold plating solution

Details Electroless gold plating solution Electroless gold plating solution

2005-02-15

2005-02-15

Klemanski, Helene (Department: 1755)

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

C106S001260, C427S443100

Reexamination Certificate

active

06855191

ABSTRACT:
An electroless gold plating solution is provided in which an amount of gold deposited by a displacement reaction is at least 15 μg/cm2, and the electroless gold plating solution includes a reducing agent that is oxidized by gold, and a reducing agent that is of the same type as or is a different type from the above reducing agent and is oxidized by a substrate metal. The solution can form a uniform gold coating having good adhesion and low porosity in one step.

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Bedetti, F.V., et al., “Porosity testing of electroplated gold in gelled media.” Plating. 53:305-308 (1966), no month.
Hasegawa, K., et al., “Electroless gold plating for semiconductor package substrate.” 1997 IEMT/IMC Proceedings, pp. 230-233 (1997), no month.
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Iacovangelo, C.D., “Autocatalytic electroless gold deposition using hydrazine and dimethylamine borane as reducing agents.” J. Electrochem. Soc. 138(4):976-982. (1991), no month.

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