Electroless gold plating solution

Details Electroless gold plating solution Electroless gold plating solution

1987-08-31

1989-02-14

Silverberg, Sam

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 98, 427125, 4274431, 106 105, 106 126, C23C 302

Patent

active

048045594

ABSTRACT:
An electroless gold plating solution comprising a thiosulfato gold(I) complex, a thiosulfate, thiourea, a pH regulator and a stabilizer. The electroless gold plating solution shows a plating rate and a plating solution stability comparable to those of conventional gold plating solutions containing cyanide ions, and requires a smaller amount of reducing agent to be used therein. Further, the electroless gold plating solution is safe because it does not contain cyanide ions.

REFERENCES:
patent: 3300328 (1967-01-01), Luce
patent: 3697296 (1972-10-01), Bellis

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