Electroless gold plating solution

Details Electroless gold plating solution Electroless gold plating solution

1995-08-14

1997-02-11

Klemanski, Helene

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

106 126, C23C 1852

Patent

active

056016379

ABSTRACT:
The present invention provides an electroless gold plating solution which offers deposition layers exactly onto predetermined areas on the surface of the workpiece, without undesirable spread of plated areas. The electroless gold plating solution according to the invention contains 5-500 mg/l, or preferably 10-100 mg/l, or sodium nitrobenzenesulfonate and/or p-nitrobenzoic acid as a reduction inhibitor.

REFERENCES:
patent: 4188234 (1978-10-01), Jans
patent: 4337091 (1982-06-01), El-Shazly et al.
patent: 5130168 (1992-07-01), Mathe et al.
patent: 5258062 (1993-11-01), Nakazawa et al.
patent: 5277790 (1994-01-01), Morrissey
patent: 5338343 (1994-08-01), Kroll et al.
European Search Report, for EP95305653.8 (2 pages).

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