Electroless gold plating liquid

Details Electroless gold plating liquid Electroless gold plating liquid

2004-02-18

2008-09-02

Klemanski, Helene (Department: 1793)

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

C106S001260

Reexamination Certificate

active

07419536

ABSTRACT:
There is provided a cyanide-free immersion type electroless gold plating liquid that is low in toxicity, can be used near a neutral ph, and has a good solder adhesion and plating film adhesion. The electroless gold plating liquid contains a cyanide-free water-soluble gold compound and a pyrosulfurous acid compound. The plating liquid may further contain a sulfurous acid compound and an aminocarboxylic acid compound. Pyrosulfurous acid or an alkali metal, alkaline earth metal, ammonium, or another such salt thereof can be used as the pyrosulfurous acid compound.

REFERENCES:
patent: 3300328 (1967-01-01), Luce
patent: 5232492 (1993-08-01), Krulik et al.
patent: 6787233 (2004-09-01), Molteberg et al.
patent: 2006/0269761 (2006-11-01), Aiba et al.
patent: 8-291389 (1996-11-01), None
patent: 10-130855 (1998-05-01), None
patent: 10-317157 (1998-12-01), None
patent: 3 030 113 (2000-02-01), None
patent: 2002-273239 (2002-09-01), None
patent: 2003-13249 (2003-01-01), None

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