Electroless gold plating liquid

Compositions: coating or plastic – Coating or plastic compositions – Metal-depositing composition or substrate-sensitizing...

Reexamination Certificate

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Details

C106S001260

Reexamination Certificate

active

10558173

ABSTRACT:
There is provided a cyanide-free immersion type electroless gold plating liquid that is low in toxicity, can be used near a neutral ph, and has a good solder adhesion and plating film adhesion. The electroless gold plating liquid contains a cyanide-free water-soluble gold compound and a pyrosulfurous acid compound. The plating liquid may further contain a sulfurous acid compound and an aminocarboxylic acid compound. Pyrosulfurous acid or an alkali metal, alkaline earth metal, ammonium, or another such salt thereof can be used as the pyrosulfurous acid compound.

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patent: 2003-13249 (2003-01-01), None

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