Electroless gold plating composition and method for plating

Details Electroless gold plating composition and method for plating Electroless gold plating composition and method for plating

1987-06-22

1989-09-05

Beck, Shrive

Coating processes

Immersion or partial immersion

Chemical compound reducing agent utilized

427437, 427304, B05D 118

Patent

active

048637661

ABSTRACT:
An aqueous electroless gold plating composition is disclosed comprising a water-soluble alkali metal monovalent gold cyanide complex, a water-soluble alkali metal complexing agent and hydrazine or its derivatives. A method for electrolessly plating gold onto a nickel substrate is also disclosed.

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