Electroless gold plating composition

Details Electroless gold plating composition Electroless gold plating composition

1992-01-23

1993-08-03

Bell, Mark L.

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

106 126, C23C 1816, C23C 1844

Patent

active

052324923

ABSTRACT:
An electroless gold plating solution comprising a gold(I) complex, a thiosulfate, a sulfite, a pH regulator and an oxidation controller. The electroless gold plating solution uses a novel reducing agent system, the thiosulfate-sulfite-sulfate system. It shows a plating rate and a plating solution stability comparable to those of conventional gold plating solutions containing borohydride, thiourea, hydrazine, and other reducing agents.

REFERENCES:
patent: 5106413 (1992-04-01), Takehawa

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