Electroless gold plating bath and method of using same

Details Electroless gold plating bath and method of using same Electroless gold plating bath and method of using same

1989-05-15

1992-07-14

Beck, Shrive

Coating processes

Immersion or partial immersion

Chemical compound reducing agent utilized

427304, 427305, 427306, 427437, 106 123, 106 126, C23C 2600

Patent

active

051301687

ABSTRACT:
An electroless gold plating composition comprises an aqueous solution of alkali metal gold cyanide, alkali metal cyanide, alkali metal hydroxide, a reducer selected from borohydrides and alkyl amine boranes, and a stabilizer having the formula ##STR1## wherein R.sub.1 is --COOH, --OH, --CH.sub.2 OH, or --SO.sub.3 H (or an alkali metal salt thereof), R.sub.2 is --COOH, --OH, --Cl, --H, (or an alkali metal salt thereof) and is disposed in the 2, 5, or 6 ring position, and --NO.sub.2 is in the 3 or 4 ring position. This composition has a pH of 12.5-14.0, is heated at 85.degree.-95.degree. C., and operates at an oxidation/reduction potential of -550 to -700 millivolts to produce high purity gold deposits of amorphous structure and good hardness for electronic applications. The composition may be replenished as many as ten turnovers.

REFERENCES:
patent: 3589916 (1971-06-01), McCormack
patent: 3700469 (1972-10-01), Okinaka
patent: 3917885 (1975-11-01), Baker
patent: 3993491 (1976-11-01), Feldstein
patent: 3993808 (1976-11-01), Inaba
patent: 4005229 (1977-01-01), Miller
patent: 4091128 (1978-05-01), Franz
patent: 4091172 (1978-05-01), Miller
patent: 4118234 (1978-10-01), Jans
patent: 4349585 (1982-09-01), Nagashima
patent: 4652345 (1987-03-01), McBride
patent: 4830668 (1989-05-01), Wundt

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