Electroless gold plating bath

Details Electroless gold plating bath Electroless gold plating bath

1998-02-10

1999-08-10

Klemanski, Helene

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

106 126, C23C 1844

Patent

active

059353066

ABSTRACT:
This invention relates generally to a solution for electroless deposition of gold, and more particularly to a cyanide-free electroless gold solution that can be replenished by the addition of a solution of a non-cyanide complex of gold. The operating temperature range for the plating solution of the present invention ranges from about 40.degree. to about 70.degree. C. The opportunity to deposit gold at such low operating temperatures is especially beneficial for plating devices which cannot withstand the higher temperatures required for existing electroless gold solutions. The relatively low operating temperatures also provide for significant energy savings and increased operator comfort and safety as compared to existing electroless gold solutions.

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"Electroless Gold Plating Bath Using Ascorbic Acid as Reducing Agent--Recent Improvements", By M. Kato et al., Central Research Laboratory, Kanto Chemical Co., pp. 805-813, no date available.
J. Electrochem. Soc., vol. 142, No. 7, Jul. 1995, "The Autocatalytic Deposition of Gold in Nonalkaline, Gold Thiosulfate Electroless Bath", By Anne M. Sullivan, et al., pp. 2250-2255.
Plating & Surface Finishing, "Electroless Gold Plating by Disulfiteaurate Complex", By H. Honma et al., Apr., 1995, pp. 89-92.
"Electroless Gold Deposition in a Non-Alkaline, Cyanide Free Bath", By Anne Sullivan et al., Electroless Session AESF SUR/FIN '94, pp. 595-603, month unavailable.
J. Electrochem. Soc., vol. 144, No. 5, May 1997, "Electrochemical Study of the Gold Thiosulfate Reduction", By Anne M. Sullivan et al., pp. 1686-1690 .

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