Electroless gold plating

Details Electroless gold plating Electroless gold plating

1981-03-23

1982-06-29

Hayes, Lorenzo B.

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

106 126, 427304, 427437, 4274431, C23C 302

Patent

active

043370918

ABSTRACT:
Improved electroless or autocatalytic gold plating baths wherein the gold ingredient is a water soluble trivalent gold component selected from an alkali metal auricyanide, an alkali metal aurihydroxide, and an alkali metal aurate. The bath contains an amino borane, an alkali metal borohydride, or an alkali metal cyanoborohydride as the reducing agent; an alkaline agent such as an alkali metal hydroxide; and an alkaline buffering agent. Optionally, the bath may contain added alkali metal cyanide. The method of utilizing such electroless or autocatalytic plating bath for depositing gold on metallic substrates such as gold, copper, copper alloys, electroless copper, electroless nickel, nickel, nickel alloys, etc. and on a non-metallic substrates is also described and claimed.

REFERENCES:
patent: 3589916 (1971-06-01), McCormack
patent: 3697296 (1972-10-01), Bellis
patent: 3700469 (1972-10-01), Okinaka
patent: 3917885 (1975-11-01), Baker
patent: 4142902 (1979-03-01), Burke et al.
Okinaka et al., Plating, 57, 914 (1970).
Okinaka et al., Plating, 58, 1080 (1971).

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