Electroless deposition of a copper-nickel alloy on an imagewise

Details Electroless deposition of a copper-nickel alloy on an imagewise Electroless deposition of a copper-nickel alloy on an imagewise

1973-11-12

1976-01-27

Louie, Jr., Won H.

Gas separation: apparatus

Electric field separation apparatus

Electrode cleaner, apparatus part flusher, discharger, or...

96 50R, 96 60R, 96 66R, 106 1, 427304, 427437, G03C 524

Patent

active

039350134

ABSTRACT:
A physical developer composition for latent images comprises a mixture of at least one copper salt and at least one nickel salt and a reducing agent for copper and nickel salts wherein the nickel and copper salts are in such proportions that upon reduction to a metal alloy, the alloy contains from 9 to 98 mole percent copper and from 2 to 91 mole percent nickel.

REFERENCES:
patent: 3598587 (1971-08-01), Yudelson et al.
patent: 3687668 (1972-08-01), Sullivan
patent: 3719490 (1973-03-01), Yudelson et al.
patent: 3719508 (1973-03-01), Gulla et al.
patent: 3726707 (1973-04-01), Prossey et al.
patent: 3822127 (1974-07-01), Tsuboi et al.

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