Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1992-03-11
1992-12-08
Lusignan, Michael
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
427 98, 437230, 437228, 437245, 437238, C23C 2600
Patent
active
051696800
ABSTRACT:
Electroless deposition of a conducting material on an underlying conductive region is used in a fabrication of a semiconductor device. Electroless deposition provides a selective and an additive process for forming conductive layers, filling window and providing interconnections and terminals. The conducting material is selectively deposited on a catalytic underlying surface. When the underlying surface is not catalytic, an activation step is used to cause the surface to be catalytic. Where the base underlying surface is a substrate, a contact region is formed on the substrate for electroless deposition of the conducting material.
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Webster's Seventh New Collegiate Dictionary G & C Merriam Company 1963, p. 131.
A. Brenner "Electroless Plating Comes of Ages" Metal Finishing 52, (11), 1954, pp. 68-76; 52(12), 1954, pp. 61-68.
Yusuke Harada et al "The Characterization of Via-Filling Technology with Electroless Plating Method" J. Electrochem. Soc. vol. 133, pp. 2428-2429, 1986.
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Paunovic Milan
Ting Chiu H.
Dang Vi Duong
Intel Corporation
Lusignan Michael
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