Electroless copper solution

Details Electroless copper solution Electroless copper solution

1976-03-10

1978-07-11

Hayes, Lorenzo B.

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

106 126, 427437, C23C 302

Patent

active

040999742

ABSTRACT:
An electroless copper solution capable of forming an electroless deposited copper film having as a higher elongation as that of electro deposited copper film is provided, which is characterized by adding either 2,2'-dipyridyl or 2,9-dimethyl-1,10-phenanthroline, and polyethylene glycol to the well known electroless copper solution containing a copper salt, such as cupric sulfate, a complexing agent such as ethylenediaminetetraacetic acid, a reducing agent such as formalin, and a pH-adjusting agent such as alkali hydroxide as main components.
The present copper solution can provide not only a higher elongation of deposited film, but also higher depositing rate, about 3 - 4 .mu.m/hr, which is equal or superior to that of the conventional art.

REFERENCES:
patent: 3377174 (1968-04-01), Torigai et al.
patent: 3472664 (1969-10-01), Bastenbeck et al.
patent: 3607317 (1971-09-01), Schneble
patent: 3615736 (1971-10-01), Stone
patent: 3804638 (1974-04-01), Jonker et al.
Saubestre, Plating, "Stabilizing Electroless Plating Solutions", Jun., 1972, vol. 59, pp. 563-566.

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