Electroless copper plating solutions and methods of use thereof

Details Electroless copper plating solutions and methods of use thereof Electroless copper plating solutions and methods of use thereof

2005-04-05

2005-04-05

Cleveland, Michael (Department: 1762)

Coating processes

Immersion or partial immersion

Metal base

C427S443100, C106S001180, C106S001230

Reexamination Certificate

active

06875474

ABSTRACT:
Electroless copper plating solutions and methods of use thereof are disclosed. A representative electroless copper plating solution includes a reducing agent that is a source of hypophosphite ions and at least one accelerator compound that accelerates the rate of copper deposition.

REFERENCES:
patent: 3716462 (1973-02-01), Jensen
patent: 4908242 (1990-03-01), Hughes et al.
patent: 5770032 (1998-06-01), Cane
patent: 5801100 (1998-09-01), Lee et al.
patent: 6165912 (2000-12-01), McConnell et al.

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