Electroless copper plating solutions

Details Electroless copper plating solutions Electroless copper plating solutions

1978-04-21

1979-10-16

Hayes, Lorenzo B.

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

106 126, 427 92, 427 98, 427305, 427437, C23C 302

Patent

active

041712250

ABSTRACT:
Electroless copper plating bath containing a copper salt, a complexing agent, alkali and by way of reducing agent a complex of formaldehyde with an aminocarboxylic acid, -sulphonic acid or -phosphonic acid. Consequently, decomposition of the bath is greatly reduced and furthermore copper of a superior quality is obtained.

REFERENCES:
patent: 3607317 (1971-09-01), Schneble, Jr.
patent: 3615732 (1971-10-01), Shipley, Jr.
patent: 3846138 (1974-11-01), Gulla
patent: 4006269 (1977-02-01), Kerfoot

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